Advanced Packaging Part 3 – Intel’s Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscape

Intel co-developed a thermocompression bonding tool which they own hundreds of. TCB is a key enabler in their advanced packaging strategy and a key differentiator versus their competition such as TSMC on a cost and integration basis.

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