One of the most interesting areas in semiconductors for investment should be exposure to advanced packaging. As Moore's law has been slowing, the natural response has been to build more powerful systems by interconnecting an increasing amount of dies within a single module.

From the $LRCX CEO:

'These AI systems incorporate not only the GPU but a tremendous amount of high-bandwidth memory, other DRAM, NAND.. All of that is packaged up inside of a 2.5D or 3D advanced package. And so just from Lam's perspective, where we provide processes like the etch and the deposition for those advanced package steps, we see our SAM doubling in just the next 3 to 4 years.'

$AMD provided the following illustration: